Tuesday, October 25, 2016
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FEI Signs Joint Agreement with CEA-Leti

By DMO Affiliate
A three year agreement has been announced between F-E-I (FEIC) and CEA-Leti today. The companies joint agreement will characterize advanced semiconductor materials for the 22nm technology node and beyond. CEA-Leti, with its two partners on the NanoCharact
FEI Signs Joint Agreement with CEA-Leti

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